High-Energy Pulsed Plasma Power Supplies and Precision Vacuum Coating Equipment

1. High-Energy Pulsed Plasma Power Supplies

High-energy pulsed plasma power supplies are high-power-density pulsed power supplies widely used in thin-film deposition processes. They can significantly increase plasma density, accelerate thin-film deposition rates, and form high-quality dense and smooth films. A common type of high-energy pulsed plasma power supply is the High-Power Impulse Magnetron Sputtering (HiPIMS) power supply, which has the following main features and applications:

Main Features:

High robustness, providing a stable discharge process without oscillation.
Support for external synchronization and coordinated operation of multiple devices.
Maximum repetition rate up to 10 kHz.
Compatibility with various target sizes and reactive processes.
Real-time monitoring of voltage and current.

Main Applications:

Hard Coatings: Forming smoother and denser compound coatings through reactive deposition, increasing surface hardness, corrosion resistance, and reducing friction.
Optical Coatings: Improving optical properties, such as smoother surfaces and denser structures.
Diffusion Barriers: Creating high-density coatings to ensure more effective barrier effects.
Electrical Coatings: Enhancing conductivity and insulation properties.
3-D Coatings: Forming uniform films on complex-shaped surfaces.

2. Precision Vacuum Coating Equipment

Precision vacuum coating equipment is used for depositing thin films through physical or chemical methods in a vacuum environment. It is widely applied in the fields of optics, semiconductors, and decoration. Common coating techniques and equipment include:

Cathodic Arc Technology:

4G-CAE®: Uses a composite magnetic field drive, with faster arc spot movement, reduced macroparticles, and higher target utilization.
SCAE - Cylindrical Cathodic Arc: Provides good coating uniformity and a simple configuration.
LDE - Rectangular Cathodic Arc: Features adjustable magnetic fields and high target utilization.
FCAE - Enhanced Bent-Tube Magnetic-Filtered Arc: Reduces macroparticles, allows for low-temperature coating, and produces dense films.

Magnetron Sputtering Technology:

Planar Magnetron Sputtering Target: Target utilization is about 20%, with poor cooling effects.
Cylindrical Magnetron Sputtering Target: Target utilization is 70%, with good cooling effects and faster coating speeds.
Planar Moving Sputtering Cathode: Suitable for precious metal targets, with material utilization of about 60%.

Evaporation Technology:

IVD (Ion-Assisted Vacuum Deposition): Fast deposition rate, low cost, and dense film layers, suitable for corrosion-resistant coatings.

Gas Ion Etching and Assisted Deposition Technology (GISETECH®):

Uses a gas ion source to etch and clean the surface of workpieces, improving the adhesion between the film and substrate.
Assists magnetron sputtering and arc coating, enhancing the density and uniformity of the film layer.

3. Typical Equipment and Application Cases

High-Vacuum Precision Optical Thin-Film Coating Equipment (e.g., CYEB-1300R):

Suitable for high-precision coating of optical thin films, widely used in the manufacturing of optical components.

HiPIMS Plasma Generation and Film Formation Control Platform:

Using HiPIMS technology, the ionization rate of metallic Ti can reach 80%, with particle energies exceeding 100 eV.
Capable of surface modification of multi-element and complex system coatings.

These technologies and equipment have broad application prospects in industrial manufacturing and scientific research and development, and can meet the high-precision thin-film preparation needs of various industries.